远程管理
状态监控
远程运维
安全控制
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阿普奇车路协同控制器E7Pro系列Q170平台是一款综合性的高性能嵌入式工控机,专为车路协同系统而设计。它集成了强大的计算能力和丰富的功能,以满足现代交通领域对于数据处理、通信和控制的复杂需求。E7 Pro系列Q170平台嵌入式工控机采用了先进的Intel® LGA1511 6~9th处理器技术,结合Intel® Q170芯片组,提供了卓越的计算性能和稳定性。这种强大的处理器组合使得E7 Pro系列Q170平台能够迅速处理大量的数据,并实时做出准确的决策,确保车路协同系统的顺畅运行。在通信方面,E7 Pro系列Q170平台配备了多个高速网络接口和串口,支持多种通信协议,实现了与各类设备的无缝连接。这种强大的通信能力确保了控制器能够与车辆、交通信号灯、传感器等各种交通元素进行实时数据交换,从而实现了车路协同系统的高效协同和智能化控制。此外,E7 Pro系列Q170平台还提供了大容量存储空间和可扩展的内存插槽,满足了长时间数据存储和大规模应用的需求。其高效的显示输出功能,支持多种分辨率和显示接口,为用户提供了清晰、逼真的视觉体验。
值得一提的是,E7 Pro系列Q170平台还支持无线功能扩展,包括4G/5G、WIFI和蓝牙等,使得工控机具备了远程监控和管理的能力。用户可以通过移动设备或云平台对工控机进行实时访问和控制,实现了对车路协同系统的远程管理和运维。无论是应用于智能交通管理、车辆监控还是自动驾驶等领域,E7 Pro-Q170都能发挥出色的性能,推动车路协同系统的创新和发展。
Model |
E7 Pro |
|
CPU |
CPU | Intel® 6/7/8/9th Generation Core / Pentium/ Celeron Desktop CPU |
TDP | 65W | |
Socket | LGA1151 | |
Chipset | Q170 | |
BIOS | AMI UEFI BIOS (Support Watchdog Timer) | |
Memory |
Socket | 2 * Non-ECC U-DIMM Slot, Dual Channel DDR4 up to 2133MHz |
Max Capacity | 64GB, Single Max. 32GB | |
Graphics |
Controller | Intel® HD Graphics |
Ethernet |
Controller | 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
Storage |
SATA | 3 * 2.5" SATA, Quick release hard disk bays (T≤7mm) ), Support RAID 0, 1, 5 |
M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2242/2260/2280) | |
Expansion Slots |
PCIe Slot | Support PCIe module card(1*PCIe x 16+1*PCIe x4/1*PCIe x16+3*PCI/2*PCIe x8+2*PCI) PS:Expansion Card length limited 320mm,TDP limited 450W |
aDoor/MXM | 2* APQ MXM /aDoor Bus (Optional MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | |
Mini PCIe | 1 * Mini PCIe (PCIe2.0 x1 + USB 2.0, with 1*Nano SIM Card slot) | |
M.2 | 1 * M.2 Key-B (PCIe2.0 x1 + USB3.0, with 1 * SIM Card, 3042/3052 ) | |
Front I/O |
Ethernet | 2 * RJ45 |
USB | 6 * USB3.0 (Type-A, 5Gbps) | |
Display | 1 * DVI-D: max resolution up to 1920*1200 @ 60Hz 1 * VGA (DB15/F): max resolution up to 1920*1200 @ 60Hz 1 * DP: max resolution up to 4096*2160 @ 60Hz |
|
Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M) |
|
Button | 1 * Power Button + Power LED 1 * System Reset Button (Hold down 0.2 to 1s to restart, and hold down 3s to clear CMOS) |
|
Rear I/O |
Antenna | 6 * Antenna hole |
Internal I/O |
USB | 2 * USB2.0(wafer, Internal I/O) |
LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | |
TFront Panel | 1 * TFPanel (3 * USB 2.0 + FPANEL, wafer) | |
Front Panel | 1 * Front Panel (wafer) | |
Speaker | 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) | |
Serial | 2 * RS232 (COM5/6, wafer, 8x2pin, PHD2.0) | |
GPIO | 1 * 16bit GPIO (wafer) | |
LPC | 1 * LPC (wafer) | |
SATA | 3 * SATA3.0 7P Connector | |
SATA Power | 3 * SATA Power (SATA_PWR1/2/3, wafer) | |
SIM | 2 * Nano SIM | |
FAN | 2 * SYS FAN (wafer) | |
Power Supply |
Type | DC, AT/ATX |
Power Input Voltage | 18~62VDC, P=600/800/1000W | |
Connector | 1 * 3Pin Connector, P=10.16 | |
RTC Battery | CR2032 Coin Cell | |
OS Support |
Windows | 6/7th Core™: Windows 7/10/11
8/9th Core™: Windows 10/11 |
Linux | Linux | |
Watchdog |
Output | System Reset |
Interval | Programmable 1 ~ 255 sec | |
Mechanical |
Enclosure Material | Radiator: Aluminium, Box: SGCC |
Dimensions | 363mm(L) * 270mm(W) * 169mm(H) | |
Weight | Net:10.48 kg, Total:11.38 kg(Include packaging) | |
Mounting | VESA, Wallmount,Desk mounting | |
Environment |
Heat Dissipation System | Fanless(CPU)
2*9cm PWM FAN(Internal) |
Operating Temperature | -20~60℃ (SSD or M.2 Storage) | |
Storage Temperature | -40~80℃ | |
Relative Humidity | 5 to 95% RH (non-condensing) | |
Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |
Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |
Certification | CCC, CE/FCC, RoHS |